After the HI Expo: Three intense days successfully completed
After the HI Expo: Three intense days successfully completed
Three days, countless technical conversations, and a booth filled with activity. The HI Expo has come to a successful end, and we have now returned to Billund with new insights and new inspiration.
Full range of 3D scanning solutions
At our booth in Hall K, we demonstrated how 3D scanning can be used for everything from rapid quality control to advanced measurement of large components.
Many people stopped by to see our solutions in action – including the automated ZEISS ScanCobot, the handheld T-SCAN hawk 2, ATOS LRX for large objects, and the brand new ZEISS ScanPort, which we showcased for the first time in Denmark.
We encountered great curiosity and many specific questions from both existing and new contacts. It is precisely this dialogue that makes trade fairs such as HI Expo so valuable to us.
Congratulations to the winners of the DALI competition
As an extra activity at the stand, visitors could take part in our competition to win a DALI IO-8 headset.
After the exhibition, we drew lots among the participants, and the lucky winners were Peder Brix Fyrstenborg from Siemens and Mogens Søndergaard Jensen from TRECO Production.
Congratulations to both of you – and thank you to everyone who stopped by and participated.
We are already looking forward to next time
The HI exhibition confirmed once again that interest in 3D scanning and industrial measurement technology is growing.
We will take the many good conversations, ideas, and contacts with us—and look forward to building on the dialogues in the coming period.
If you didn't get a chance to visit our booth, you can still keep up with our news, case studies, and upcoming events in our newsletter, zebinside.
NB: the newsletter is in Danish.
